Thông tin nổi bật

• Processor: Intel® Xeon® Gold 5220R 2.2 GHz 35.75MB Cache 24C/48T
• Memory: 8 x 32GB DDR4 2933Mhz ECC RDIMM (up to 24 slots - 6TB RAM)
• Storages: 4x SSD 3.84TB NVME PCIe3x4 NF1 (Up to 32 x hot-swap PCI-E NF1)
• Network: 1x Dual-Port 25Gbps Controller 
• Power: 2x 1600W

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, 2 DIMMs and 4 NF1).

Key Features

  - IOPS Intensive Storage App.
  - Database App. (MySQL, Casandra)
  - Hyperconverged Infrastructure /
    Scale-out Architectures

1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡

2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

3. 2 PCI-E 3.0 x16 slots, 1 PCI-E 3.0 x4 slot

4. 32 Hot-swap PCI-E NF1 drive bays, 4 SATA3 M.2 drive bays support M.2 Form Factor 22x42/60/80/110

5. 2x 10GBase-T LAN ports via Intel X550

6. 8 Heavy duty 4cm counter-rotating fans with air shroud

7. 1600W Redundant Power Supplies Titanium Level (96%)

Thông tin nổi bật

Key Features

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s

2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

3. 2 PCI-E 3.0 x16 (FHHL) slots

4. 10 Hot-swap 2.5" SAS/SATA HDD bays (default 8 SATA3, 2 NVMe or SATA2)

5. Intel® i350-AM2 Dual port GbE LAN

6. I/O ports: 2 SuperDOM, 1 VGA, 1 COM, 2 USB 3.0 (front), 4 USB 2.0 (rear)

7. 2 SuperDOM (Disk on Module) ports

8. 700W Redundant Power Supplies Platinum Level High-efficiency

Thông tin nổi bật

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs and 4 DIMMs).

Key Features

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s

2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots

3. 2x PCI-E 3.0 x16 slots (FH, 10.5" L), 2x PCI-E 3.0 x8 slots (LP, 1 internal)

4. 2x 10GBase-T ports

5. 10x Hot-swap 2.5" Drive Bays: Default 8x SATA3 ports and 2x NVMe/SATA3 hybrid ports; Optional 8x SAS3 ports via AOC

6. 5x heavy duty fans w/ optimal fan speed control

7. 750W Redundant Power Supplies Platinum Level (94%+)

Thông tin nổi bật

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, 4 DIMMs and 4 NVMe).

Key Features  

  - High Throughput Ingest
  - High Density Hot Storage
  - HPC / Data Analytics
  - Media/Video Streaming
  - Content Delivery Network (CDN)
  - Big Data Top of Rack Storage
 

2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM, Supports Intel® Optane™ DCPMM††

3. 2 PCI-E 3.0 x16 Low-profile slots

4. Dual Drawer/Tray with a total of 32 NVMe 2.5" SSDs

5. 2x 10GBase-T LAN ports

6. Built in Intel QAT for Crypto/Compression

7. 8x 40x56mm PWM fans

8. 1600W Redundant Power Supplies Platinum Level

Thông tin nổi bật

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, 4 DIMMs, 1 NIC adapter*, and 6 drives). *NIC adapter requirement includes either 1 Ultra Riser card with integrated NIC or 1 Ultra Riser card AOC-URN4 with 1 standard PCI-E NIC adapter.

Key Applications

• Virtualization
• Cloud Computing
• High End Enterprise Server Key Features

1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡

2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

3. 1 PCI-E 3.0 x16 (FH, 10.5"L), 1 PCI-E 3.0 x8 (LP), 1 internal PCI-E 3.0 x16 (for SMCI storage controller)

4. Flexible networking options, up to 25GbE via Ultra Riser card

5. 12 Hot-swap 2.5" NVMe/SATA3 drive bays

6. 8 Heavy duty fans w/ optimal fan speed control

7. 1200W Redundant Power Supplies Titanium Level (96%)

Thông tin nổi bật

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, 2 DIMMs, 1 NVMe and 1 SIOM card per node).

Key Features

  - Compute Intensive Application
  - HPC, Data Center
  - Enterprise Server
  - Financial Analysis
  - Mission-critical applications

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s

2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots

3. 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking) Note: must bundle with Network card

4. IPMI 2.0 + KVM with dedicated LAN

5. 6 Hot-swap 2.5" NVMe drive bays

6. Video via Aspeed AST2400 BMC

7. 4x 8cm heavy duty PWM fans with air shroud

8. 2200W Redundant Power Supplies Titanium Level

9. 2 M.2 Cards support

Thông tin nổi bật

Key Features

Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s

2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots

3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 slots

4. Intel® i350 Dual port GbE LAN

5. Integrated IPMI 2.0 with KVM and Dedicated LAN

6. 4 NVMe and 8 Hot-swap 2.5" SAS drives

7. Broadcom 3008 SAS3 controller (8 ports); RAID 0, 1, 10

8. 1600W Redundant Power Supplies Titanium Level (96%)

Thông tin nổi bật

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs and 4 DIMMs).

Key Features

• Flexible Connectivity Options

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s

2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots

3. 7 PCI-E 3.0 x8 slots (5 FH, 10.5" L, 1 LP, 1 Internal LP)

4. 2x 10GBase-T ports

5. 24 Hot-swap 2.5" Drive Bays: Default 8 SATA3 ports and 4 NVMe ports; Optional 24 SAS3 ports via AOC; Optional 2 hot-swap 2.5" rear drive bays for SSDs

6. 4 heavy duty fans w/ optimal fan speed control

7. 1000W High efficiency (96%) Redundant PSU; Titanium Level

Thông tin nổi bật

- Compute Intensive Application
- Enterprise Server, High Density
Hot Storage

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡

2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 (x16) Low-profile slots,

1 SIOM card support Note: must bundle with Network card

4. 10 EDSFF (E1.S) drive bays and 2 SATA M.2 drive bays per node

5. IPMI 2.0 + KVM with dedicated LAN

6. Video via Aspeed AST2500 BMC

7. 4 Heavy duty 8cm PWM fans with air shroud

8. 2600W Redundant Power Supplies Titanium Level (96%)

Thông tin nổi bật

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, 4 DIMMs and a storage add-on-card).

Key Features

Virtualization
Hyperconverge Storage
Cloud Computing
High End Enterprise Server

2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

3. 2 PCI-E 3.0 x16 slots (FH, 10.5" L),
    4 PCI-E 3.0 x8 slots (FH, 10.5" L),
    1 PCI-E 3.0 x8 slot (LP)

4. 4x 10GBase-T LAN ports via Intel X710

5. 24 Hot-swap 2.5" drive bays:
    24 SAS3 via opt. AOC
    (4 hybrid ports - opt. 4 NVMe),
    Optional 2 hot-swap 2.5" rear drive
    bays for SSDs;
    Optional M.2 NVMe and SATA3 ports

6. VGA: Aspeed AST2500

7. 4 Heavy duty 8cm PWM fans

8. 1000W Redundant Power Supplies Titanium Level (96%)

Thông tin nổi bật

Key Features4 Hot-plug System Nodes in 4U
Each node supports:

1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡

2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

3. Expansion slots: 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x16 (for SIOM )

4. SIOM Network card, 1 dedicated IPMI LAN port

5. 1 VGA, 2 USB 3.0 ports

6. 8 Hot-swap 3.5" SAS3/SATA3 or
    6 Hot-swap 3.5" SAS3/SATA3 +
    2 optional NVMe U.2
    M.2 Interface: PCI-E 3.0 x4
    M.2 Form Factor: 2260, 2280, 22110
    M.2 Key: M-Key

7. SAS3 via Broadcom 3008

8. 2x 8cm 14k RPM middle fans

9. 1200W Redundant Power Supplies Titanium Level (96% Efficiency)

Thông tin nổi bật

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (including but not limited to 2 CPUs, 4 DIMMs, and 4 drives).

Key Features

  - High Throughput Ingest
  - High Density Hot Storage
  - HPC / Data Analytics
  - Media/Video Streaming
  - Content Delivery Network (CDN)
  - Big Data Top of Rack Storage
 

2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM, Supports Intel® Optane™ DCPMM††

3. 2 PCI-E 3.0 x16 Low-profile slots

4. 32 Hot-swap EDSFF Long 9.5mm drive slots

5. 2x 10GBase-T LAN ports

6. Built in Intel QAT for Crypto/Compression

7. 8x 40mm fans

8. 1600W Redundant Power Supplies Platinum Level

Thông tin nổi bật

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (including but not limited to 2 CPUs, 2 DIMMs, and 4 drives).

Key Features

  - IOPS Intensive Application
  - Database Application
  - Hyperconverged Infrastructure

1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡

2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

3. 2 PCI-E 3.0 x16 (FHHL) slots, 1 PCI-E 3.0 x4 (LP) slot

4. 32 Hot-swap PCI-E E1.S or M.2 drive bays (M.2 is not hot-swappable). M.2 supports Form Factor 22x42/60/80/110 (MCP-220-12106-0N tray required)

5. 2x 10GBase-T LAN ports via Intel X550

6. 8x 40x56mm counter-rotation PWM fans

7. 1600W Redundant Power Supplies Titanium Level (96%)

Thông tin nổi bật

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, 2 DIMMs, 24 NVMe and 1 NIC or SIOM card).

Key Features

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s

2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots

3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

4. SIOM for flexible networking options

5. 48 Hot-swap 2.5" NVMe drive bays; 2 rear Hot-swap 2.5" SATA drive bays

6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN

7. 5 Hot-swap 8cm redundant PWM fans

8. 1600W Redundant Power Supplies Titanium Level (96%)

Thông tin nổi bật

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 4 CPUs, 4 DIMMs and 12 dual port NVMe).

Key Features

2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

3. 24 U.2 Hot-swap dual-port NVMe  drive bays

4. 2 PCI-E 3.0 x16 HHHL slots, 1 PCI-E 3.0 x16 SIOM

5. Dedicated node to node connectivity featuring high performance PLX NTB PCI-E 3.0 x8 and IPMI for robust node fail-over support

6. Dual port 10GBase-T (Intel® X557-AT2), Dual 10G private ethernet between controller nodes

7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN

8. 5x 8cm high-performance PWM fans

9. 2000W Redundant Power Supplies Titanium Level (96%)

Thông tin nổi bật

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (including but not limited to 8 drives).

Key Applications

• High Throughput Ingest
• High Density Hot Storage
• HPC / Data Analytics
• Media/Video Streaming
• Content Delivery Network (CDN)
• Big Data Top of Rack StorageOutstanding Features

1. Supports 32 Hot-swap NVMe SSDs
2. Individual SSD power cycling
3. 4 PCI-E x16 IO ports, 2 PCI-E x16 slots
4. IPMI management with dedicated LAN
5.  1000W Redundant Power Supplies Titanium Level (96%)