Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:
1. Dual socket P (LGA 3647) supports
Intel® Xeon® Scalable Processors,
Dual UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to
DDR4-2666MHz; 16 DIMM slots
3. 2 PCI-E 3.0 x16 slots
4. Flexible Networking support via SIOM;
Dedicated IPMI 2.0 LAN
5. 4 Hot-swap 2.5" SAS3 drive bays
6. Broadcom 3008 SAS3 controller; SW RAID
7. 2 SuperDOM onboard or optional
2 M.2 carrier
8. Up to 1000W Redundant Power Supplies
Titanium Level (96%)
Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:
1. Dual socket P (LGA 3647) supports
Intel® Xeon® Scalable Processors,
Dual UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to
DDR4-2666MHz; 16 DIMM slots
3. 2 PCI-E 3.0 x16 slots
4. Flexible Networking support via SIOM;
Dedicated IPMI 2.0 LAN
5. 4 Hot-swap 2.5" SAS3 drive bays
6. Broadcom 3108 SAS3 controller;
RAID 0, 1, 5, 6, 10, 50, 60 with
SuperCap option
7. 2 SuperDOM onboard
8. Up to 1000W Redundant Power Supplies
Titanium Level (96%)
Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:
1. Dual socket P (LGA 3647) supports
Intel® Xeon® Scalable Processors,
Dual UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to
DDR4-2666MHz; 16 DIMM slots
3. 2 PCI-E 3.0 x16 slots
4. Flexible Networking support via SIOM;
Dedicated IPMI 2.0 LAN
5. 4 Hot-swap 2.5" SATA3 drive bays
6. 2 SuperDOM onboard or optional
2 M.2 carrier
7. Up to 1000W Redundant Power Supplies
Titanium Level (96%)
4 DP nodes in 2U; depth 28.5", Each Node:
Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
SAS3 support via Broadcom 3008; IT mode
2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
4 heavy duty 80mm fans w/ optimal fan speed control
2200W Redundant Titanium Level (96%) Power Supplies
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual socket P (LGA 3647) supports
Intel® Xeon® Scalable Processors,
Dual UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to
DDR4-2666MHz; 16 DIMM slots
3. 2 PCI-E 3.0 x16 slots
4. Flexible Networking support via SIOM;
Dedicated IPMI 2.0 LAN
5. 6 Hot-swap 2.5" SAS/SATA drive bays
6. Broadcom 3008 SAS3 controller;
RAID 0, 1, 10
7. Mini-mSATA (half size) support on 3008
backplane
8. Up to 2200W Redundant Power Supplies
Titanium Level (96%)
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual socket P (LGA 3647) supports
Intel® Xeon® Scalable Processors,
Dual UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to
DDR4-2666MHz; 16 DIMM slots
3. 2 PCI-E 3.0 x16 slots
4. Flexible Networking support via SIOM;
Dedicated IPMI 2.0 LAN
5. 6 Hot-swap 2.5" SAS/SATA drive bays
6. Broadcom 3108 SAS3 controller;
RAID 0, 1, 5, 6, 10, 50, 60 with
SuperCap option
7. Up to 2200W Redundant Power Supplies
Titanium Level (96%)
4 DP nodes in 2U; depth 30.11", Each Node:
Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
24 DIMM slots; up to 3TB ECC 3DS L/RDIMM, up to DDR4‑2666MHz
3 Hot-swap NVMe/SAS3 drive bays per node
SAS3 support via Broadcom 3008; IT mode
2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
4 heavy duty 80mm fans w/ optimal fan speed control
2200W Redundant Titanium Level (96%) Power Supplies
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual socket P (LGA 3647) supports
Intel® Xeon® Scalable Processors,
Dual UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to
DDR4-2666MHz; 16 DIMM slots
3. 2 PCI-E 3.0 x16 slots
4. Flexible Networking support via SIOM;
Dedicated IPMI 2.0 LAN
5. 3 Hot-swap 3.5" SAS/SATA drive bays
6. Broadcom 3008 SAS3 controller;
RAID 0, 1, 10
7. Mini-mSATA (half size) support
8. Up to 2200W Redundant Power Supplies
Titanium Level (96%)
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual socket P (LGA 3647) supports
Intel® Xeon® Scalable Processors,
Dual UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to
DDR4-2666MHz; 16 DIMM slots
3. 2 PCI-E 3.0 x16 slots
4. Flexible Networking support via SIOM;
Dedicated IPMI 2.0 LAN
5. 3 Hot-swap 3.5" SAS/SATA drive bays
6. Broadcom 3108 SAS3 controller;
RAID 0, 1, 5 with SuperCap option
7. Up to 2200W Redundant Power Supplies
Titanium Level (96%)
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