Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:
1. Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600
v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
DDR4- 2400†MHz ; 16x DIMM slots
3. 1x PCI-E 3.0 x16 Low-profile slot
and 1x "0 slot"
4. Single port IB (FDR, 56Gbps),
w/ QSFP connector
5. Intel® i350 Dual port GbE LAN
6. Integrated IPMI 2.0 with KVM and
Dedicated LAN
7. 4x 2.5" Hot-swap SAS3 drive bays
8. Broadcom 3008 SAS3 controller; SW RAID
9. 1000W Redundant Power Supplies
Titanium Level (96%)
Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:
1. Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600
v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
DDR4- 2400†MHz ; 16x DIMM slots
3. 1x PCI-E 3.0 x16 Low-profile slot
and 1x "0 slot"
4. Intel® i350 Dual port GbE LAN
5. Integrated IPMI 2.0 with KVM and
Dedicated LAN
6. 4x 2.5" Hot-swap SAS3 drive bays
7. Broadcom 3008 SAS3 controller; SW RAID
8. 1000W Redundant Power Supplies
Titanium Level (96%)
Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:
1. Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600
v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
DDR4- 2400†MHz ; 16x DIMM slots
3. 1x PCI-E 3.0 x16 Low-profile slot
and 1x "0 slot"
4. Intel® X540 Dual port 10GBase-T LAN
5. Integrated IPMI 2.0 with KVM and
Dedicated LAN
6. 4x 2.5" Hot-swap SAS3 drive bays
7. Broadcom 3008 SAS3 controller; SW RAID
8. 1000W Redundant Power Supplies
Titanium Level (96%)
Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:
1. Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600
v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
DDR4- 2400†MHz ; 16x DIMM slots
3. 1x PCI-E 3.0 x16 Low-profile slot
and 1x "0 slot"
4. Single port IB (FDR, 56Gbps),
w/ QSFP connector
5. Intel® i350 Dual port GbE LAN
6. Integrated IPMI 2.0 with KVM and
Dedicated LAN
7. 4x 2.5" Hot-swap SATA3 drive bays
8. 1000W Redundant Power Supplies
Titanium Level (96%)
Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:
1. Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600
v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
DDR4- 2400†MHz ; 16x DIMM slots
3. 1x PCI-E 3.0 x16 Low-profile slot
and 1x "0 slot"
4. Intel® i350 Dual port GbE LAN
5. Integrated IPMI 2.0 with KVM and
Dedicated LAN
6. 4x 2.5" Hot-swap SATA3 drive bays
7. 1000W Redundant Power Supplies
Titanium Level (96%)
Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:
1. Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600
v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
DDR4- 2400†MHz ; 16x DIMM slots
3. 1x PCI-E 3.0 x16 Low-profile slot
and 1x "0 slot"
4. Intel® X540 Dual port 10GBase-T LAN
5. Integrated IPMI 2.0 with KVM and
Dedicated LAN
6. 4x 2.5" Hot-swap SATA3 drive bays
7. 1000W Redundant Power Supplies
Titanium Level (96%)
Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:
1. Dual socket P (LGA 3647) supports
Intel® Xeon® Scalable Processors,
Dual UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to
DDR4-2666MHz; 16 DIMM slots
3. 2 PCI-E 3.0 x16 slots
4. Flexible Networking support via SIOM;
Dedicated IPMI 2.0 LAN
5. 4 Hot-swap 2.5" SAS3 drive bays
6. Broadcom 3008 SAS3 controller; SW RAID
7. 2 SuperDOM onboard or optional
2 M.2 carrier
8. Up to 1000W Redundant Power Supplies
Titanium Level (96%)
Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:
1. Dual socket P (LGA 3647) supports
Intel® Xeon® Scalable Processors,
Dual UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to
DDR4-2666MHz; 16 DIMM slots
3. 2 PCI-E 3.0 x16 slots
4. Flexible Networking support via SIOM;
Dedicated IPMI 2.0 LAN
5. 4 Hot-swap 2.5" SAS3 drive bays
6. Broadcom 3108 SAS3 controller;
RAID 0, 1, 5, 6, 10, 50, 60 with
SuperCap option
7. 2 SuperDOM onboard
8. Up to 1000W Redundant Power Supplies
Titanium Level (96%)
Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:
1. Dual socket P (LGA 3647) supports
Intel® Xeon® Scalable Processors,
Dual UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to
DDR4-2666MHz; 16 DIMM slots
3. 2 PCI-E 3.0 x16 slots
4. Flexible Networking support via SIOM;
Dedicated IPMI 2.0 LAN
5. 4 Hot-swap 2.5" SATA3 drive bays
6. 2 SuperDOM onboard or optional
2 M.2 carrier
7. Up to 1000W Redundant Power Supplies
Titanium Level (96%)
4 DP nodes in 2U; depth 28.75", Each Node:
Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family
24 DIMM slots; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2400MHz
2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
At least one network card must be bundled
6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
SAS3 support via Broadcom 3008; IT mode
1 Dedicated IPMI port, 1 VGA, 2 USB 3.0
System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
4 heavy duty 80mm fans w/ optimal fan speed control
2200W Redundant Titanium Level (96%) High-efficiency Power Supplies
4 DP nodes in 2U; depth 28.75", Each Node:
Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family
24 DIMM slots; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2400MHz
2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
At least one network card must be bundled
6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
SAS3 support via Broadcom 3108; HW RAID 0, 1, 5, 6, 10, 50, 60
1 Dedicated IPMI port, 1 VGA, 2 USB 3.0
System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
4 heavy duty 80mm fans w/ optimal fan speed control
2200W Redundant Titanium Level (96%) Power Supplies
4 DP nodes in 2U; depth 28.75", Each Node:
Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family
24 DIMM slots; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2400MHz
2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
At least one network card must be bundled
6 Hot-swap 2.5" NVMe drive bays per node
1 Dedicated IPMI port, 1 VGA, 2 USB 3.0
System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
4 heavy duty 80mm fans w/ optimal fan speed control
2200W Redundant Titanium Level (96%) High-efficiency Power Supplies
4 DP nodes in 2U; depth 28.75", Each Node:
Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family
24 DIMM slots; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2400MHz
2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
At least one network card must be bundled
6 Hot-swap 2.5" SATA3 drive bays per node
1 Dedicated IPMI port, 1 VGA, 2 USB 3.0
System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
4 heavy duty 80mm fans w/ optimal fan speed control
2200W Redundant Titanium Level (96%) High-efficiency Power Supplies
Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600
v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
DDR4- 2400†MHz ; 16 DIMM slots
3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8,
and 1 "0 slot"
4. Single port IB (FDR, 56Gbps),
w/ QSFP connector
5. Intel® i350-AM2 Dual port GbE LAN
6. Integrated IPMI 2.0 with KVM and
Dedicated LAN
7. 12 Hot-swap 2.5" SAS (8) / SATA (4)
HDD Bays
8. Broadcom 3008 SAS3 controller (8 ports);
RAID 0, 1, 10
9. mSATA (full size) support
10. 1280W Redundant Power Supplies
Platinum Level Digital (94%)
Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600
v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
DDR4- 2400†MHz ; 16 DIMM slots
3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8,
and 1 "0 slot"
4. Intel® i350-AM2 Dual port GbE LAN
5. Integrated IPMI 2.0 with KVM and
Dedicated LAN
6. 12 Hot-swap 2.5" SAS (8) / SATA (4)
HDD Bays
7. Broadcom 3008 SAS3 controller (8 ports);
RAID 0, 1, 10
8. mSATA (full size) support
9. 1280W Redundant Power Supplies
Platinum Level Digital (94%)
Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600
v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
DDR4- 2400†MHz ; 16 DIMM slots
3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8,
and 1 "0 slot"
4. Intel® X540 Dual port 10GBase-T LAN
5. Integrated IPMI 2.0 with KVM and
Dedicated LAN
6. 12 Hot-swap 2.5" SAS (8) / SATA (4)
HDD Bays
7. Broadcom 3008 SAS3 controller (8 ports);
RAID 0, 1, 10
8. mSATA (full size) support
9. 1280W Redundant Power Supplies
Platinum Level Digital (94%)
Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600
v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
DDR4- 2400†MHz ; 16 DIMM slots
3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 slot,
and 1 PCI-E 3.0 x16 for
GPU/Xeon Phi support (w/ GPU kit)
4. Single port IB (FDR, 56Gbps),
w/ QSFP connector
5. Intel® i350-AM2 Dual port GbE LAN
6. Integrated IPMI 2.0 with KVM and
Dedicated LAN
7. 12 Hot-swap 2.5" SAS (8) / SATA (4)
HDD Bays
8. Broadcom 3108 SAS3 controller (8 ports);
RAID 0, 1, 5, 6, 10, 50, 60
9. mSATA (full size) support
10. 1280W Redundant Power Supplies
Platinum Level Digital (94%)
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