Thông tin nổi bật

- Compute Intensive Application
- Enterprise Server, High Density
Hot Storage

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡

2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 (x16) Low-profile slots,

1 SIOM card support Note: must bundle with Network card

4. 10 EDSFF (E1.S) drive bays and 2 SATA M.2 drive bays per node

5. IPMI 2.0 + KVM with dedicated LAN

6. Video via Aspeed AST2500 BMC

7. 4 Heavy duty 8cm PWM fans with air shroud

8. 2600W Redundant Power Supplies Titanium Level (96%)

Thông tin nổi bật

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, 4 DIMMs and a storage add-on-card).

Key Features

Virtualization
Hyperconverge Storage
Cloud Computing
High End Enterprise Server

2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

3. 2 PCI-E 3.0 x16 slots (FH, 10.5" L),
    4 PCI-E 3.0 x8 slots (FH, 10.5" L),
    1 PCI-E 3.0 x8 slot (LP)

4. 4x 10GBase-T LAN ports via Intel X710

5. 24 Hot-swap 2.5" drive bays:
    24 SAS3 via opt. AOC
    (4 hybrid ports - opt. 4 NVMe),
    Optional 2 hot-swap 2.5" rear drive
    bays for SSDs;
    Optional M.2 NVMe and SATA3 ports

6. VGA: Aspeed AST2500

7. 4 Heavy duty 8cm PWM fans

8. 1000W Redundant Power Supplies Titanium Level (96%)

Thông tin nổi bật

• Processor: 4x Intel® Xeon® Processor Silver CLX-SP 4210R 10C/20T 2.4G 13.75M 9.6GT 2UPI
• Memory: 64GB RAM (4x 16GB) DDR4 2933Mhz ECC RDIMM (up to 8 slots - 2TB RAM each node)
• Raid: 0,1,5,10 Onboard
• Storages: 4x SSD 240GB 2.5" SATA 6Gb/s
• Power: Up to 1200W Redundant Power Supplies Titanium Level (96%)

Thông tin nổi bật

• Processor: 8x Intel® Xeon® Processor Silver CLX-SP 4210R 10C/20T 2.4G 13.75M 9.6GT 2UPI
• Memory: 128GB RAM (8x 16GB) DDR4 2933Mhz ECC RDIMM (up to 8 slots - 2TB RAM each node)
• Raid: 0,1,5,10 Onboard
• Storages: 8x SSD 240GB 2.5" SATA 6Gb/s
• DVD RW: No
• Power: Up to 1600W Redundant Power Supplies Titanium Level (96%)
• Form Factor: 2U Rackmount

Thông tin nổi bật

Key Features4 Hot-plug System Nodes in 4U
Each node supports:

1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡

2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

3. Expansion slots: 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x16 (for SIOM )

4. SIOM Network card, 1 dedicated IPMI LAN port

5. 1 VGA, 2 USB 3.0 ports

6. 8 Hot-swap 3.5" SAS3/SATA3 or
    6 Hot-swap 3.5" SAS3/SATA3 +
    2 optional NVMe U.2
    M.2 Interface: PCI-E 3.0 x4
    M.2 Form Factor: 2260, 2280, 22110
    M.2 Key: M-Key

7. SAS3 via Broadcom 3008

8. 2x 8cm 14k RPM middle fans

9. 1200W Redundant Power Supplies Titanium Level (96% Efficiency)

Thông tin nổi bật

• Processor: 4x Intel® Xeon® Processor Silver 4310 2P 12C/24T 2.1G 18M 10.4GT 120W 4189 M1
• Memory: 64GB RAM (4x 16GB) DDR4 2933Mhz ECC RDIMM (up to 16 slots - Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM each node)
• Raid: 0,1,5,10 Onboard
• Storages: 4x SSD 240GB 2.5" SATA 6Gb/s
• Network Connectivity: 2x 10GbE BaseT with Intel® X710-AT2
• DVD RW: No
• Power: Up to 1000W Redundant Power Supplies Titanium Level (96%)
• Form Factor: 1U Rackmount

Thông tin nổi bật

 Key Applications

- Artificial Intelligence (AI)
- Business Intelligence
- ERP, CRM
- Scientific Virtualization
- In-Memory Database
- HCI
- SAP HANA

 Key Features

1. Quad Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable processors

2. 48 DIMMs; Up to 18TB 3DS ECC DDR4-3200:LRDIMM/RDIMM/DCPMM

3. Intel® Ethernet Controller X710-TM4 2x 10G RJ45 + 2x 10G SFP+ port; (optional) AIOM up to 100G QSFP28

4. 24 Hot-swap 2.5" Hybrid NVMe/SAS3/SATA3 drive bays; on board 2 M.2 SATA

5. 4 heavy duty fans w/ optimal fan speed control; 1 Air Shroud

Thông tin nổi bật

• Processor: 8x Intel® Xeon® Processor Silver 4310 2P 12C/24T 2.1G 18M 10.4GT 120W 4189 M1
• Memory: 128GB RAM (4x 16GB) DDR4 2933Mhz ECC RDIMM (up to 16 slots - Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM each node)
• Raid: 0,1,5 Onboard
• Storages: 8x SSD 240GB 2.5" SATA 6Gb/s
• Network Connectivity: 2x 10GbE BaseT with Intel® X710-AT2
• DVD RW: No
• Power: Up to 2200W Redundant Power Supplies Titanium Level (96%)
• Form Factor: 2U Rackmount

Thông tin nổi bật

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (including but not limited to 2 CPUs, 4 DIMMs, and 4 drives).

Key Features

  - High Throughput Ingest
  - High Density Hot Storage
  - HPC / Data Analytics
  - Media/Video Streaming
  - Content Delivery Network (CDN)
  - Big Data Top of Rack Storage
 

2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM, Supports Intel® Optane™ DCPMM††

3. 2 PCI-E 3.0 x16 Low-profile slots

4. 32 Hot-swap EDSFF Long 9.5mm drive slots

5. 2x 10GBase-T LAN ports

6. Built in Intel QAT for Crypto/Compression

7. 8x 40mm fans

8. 1600W Redundant Power Supplies Platinum Level

Thông tin nổi bật

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (including but not limited to 2 CPUs, 2 DIMMs, and 4 drives).

Key Features

  - IOPS Intensive Application
  - Database Application
  - Hyperconverged Infrastructure

1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡

2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

3. 2 PCI-E 3.0 x16 (FHHL) slots, 1 PCI-E 3.0 x4 (LP) slot

4. 32 Hot-swap PCI-E E1.S or M.2 drive bays (M.2 is not hot-swappable). M.2 supports Form Factor 22x42/60/80/110 (MCP-220-12106-0N tray required)

5. 2x 10GBase-T LAN ports via Intel X550

6. 8x 40x56mm counter-rotation PWM fans

7. 1600W Redundant Power Supplies Titanium Level (96%)

Thông tin nổi bật

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 4 CPUs, 4 DIMMs and 12 dual port NVMe).

Key Features

2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

3. 24 U.2 Hot-swap dual-port NVMe  drive bays

4. 2 PCI-E 3.0 x16 HHHL slots, 1 PCI-E 3.0 x16 SIOM

5. Dedicated node to node connectivity featuring high performance PLX NTB PCI-E 3.0 x8 and IPMI for robust node fail-over support

6. Dual port 10GBase-T (Intel® X557-AT2), Dual 10G private ethernet between controller nodes

7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN

8. 5x 8cm high-performance PWM fans

9. 2000W Redundant Power Supplies Titanium Level (96%)

Thông tin nổi bật

• Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)
• 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM
• 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card support (flexible networking)
  •   Note: must bundle with Network card
• 24 Hot-swap 3.5" SAS3/SATA3 drive bays; 2 hot-swap 2.5" SATA3 drive bays (rear), Expander based backplane
• Broadcom 3108 SAS3, HW RAID
• 1600W Redundant Power Supplies Titanium Level (96%)

Thông tin nổi bật

• IOPS Intensive Storage Applications, Database Applications (MySQL, Casandra), Virtual Storage Environments, Single Instance Storage & Data Deduplication
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family; QPI up to 9.6GT/s
• 48 Hot-swap 2.5" SAS3/SATA3 drive bays, 2 Hot-swap 2.5" drive bays (rear); Cable-arm for second row drives' hot-swap access
• SAS3 via Broadcom 3008, IT mode controller
• 24 DIMM slots; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2400MHz
• 2 PCI-E 3.0 x16 slots
• I/O: SIOM for flexible networking options, 2 USB 3.0
• System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
• 5 Hot-swap 80mm redundant PWM cooling fans
• 1600W Redundant Titanium Level (96%) Power Supplies

Thông tin nổi bật

• IOPS Intensive Storage Applications, Database Applications (MySQL, Casandra), Virtual Storage Environments, Single Instance Storage & Data Deduplication
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family; QPI up to 9.6GT/s
• 48 Hot-swap 2.5" SAS3/SATA3 drive bays, 2 Hot-swap 2.5" drive bays (rear); Cable-arm for second row drives' hot-swap access
• SAS3 via Broadcom 3108, HW RAID 0, 1, 5, 6, 10, 50, 60
• 24 DIMM slots; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2400MHz
• 2 PCI-E 3.0 x16 and 1 PCI-E 3.0 x8 slots
• I/O: SIOM for flexible networking options, 2 USB 3.0
• System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
• 5 Hot-swap 80mm redundant PWM cooling fans
• 1600W Redundant Titanium Level (96%) Power Supplies

Thông tin nổi bật

• IOPS Intensive Storage Applications, Database Applications (MySQL, Casandra), Virtual Storage Environments, Single Instance Storage & Data Deduplication
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family; QPI up to 9.6GT/s
• 48 Hot-swap 2.5" NVMe bays; 2 Hot-swap 2.5" drive bays (rear) Cable-arm for second row drives' hot-swap access
• 24 DIMM slots; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2400MHz
• 1 PCI-E 3.0 x16 and 1 PCI-E 3.0 x8 slots
• I/O: SIOM for flexible networking options, 2 USB 3.0
• System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
• 5 Hot-swap 80mm redundant PWM cooling fans
• 1600W Redundant Titanium Level (96%) Power Supplies

Thông tin nổi bật

• Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
• 24 Hot-swap 2.5" SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
• Storage Options:
  • SSG-2029P-ACR24H - SAS3 via Broadcom 3108 AOC
  • SSG-2029P-ACR24L - SAS3 via Broadcom 3008 AOC
• 16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
• 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
• 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
• 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
• 3 Hot-swap 8cm redundant PWM cooling fans
• 1200W Redundant Titanium Level (96%) Power Supplies

Thông tin nổi bật

• Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
• 24 Hot-swap 2.5" SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
• Storage Options:
  • SSG-2029P-ACR24H - SAS3 via Broadcom 3108 AOC
  • SSG-2029P-ACR24L - SAS3 via Broadcom 3008 AOC
• 16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
• 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
• 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
• 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
• 3 Hot-swap 8cm redundant PWM cooling fans
• 1200W Redundant Titanium Level (96%) Power Supplies

Thông tin nổi bật

• Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
• 24 Hot-swap 2.5" SAS3/SATA3 drive bays
• Storage Options:
  • SSG-2029P-E1CR24H - SAS3 via Broadcom 3108 AOC
  • SSG-2029P-E1CR24L - SAS3 via Broadcom 3008 AOC
• 16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
• 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports(slot 2 & 3 occupied by controller and JBOD expansion port)
• 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
• 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
• 3 Hot-swap 8cm redundant PWM cooling fans
• 1200W Redundant Titanium Level (96%) Power Supplies

Thông tin nổi bật

• 2U Storage Server – Expansion / Capacity / Cost per TB
• Single Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family; QPI up to 9.6GT/s
• 12 Hot-swap 3.5" SAS3 HDD Bays (SAS3 via Onboard Broadcom 3008 to SAS3 backplane); 2x Rear optional 2.5" Hot-swap HDD Bays
• 8 DIMM slots; up to 1TB ECC 3DS LRDIMM or RDIMM DDR4‑2400MHz
• 4 PCI-E 3.0 (x8/4, x16/8, x8) + 2 PCI-E 2.0 (x8/4, x4/2)
• I/O ports: 4 GbE, 1 Video, 1 COM/Serial, 2 USB 3.0, 2 USB 2.0
• System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
• 3 heavy duty fans w/ optimal fan speed control
• 920W Redundant Platinum Level Power Supplies

Thông tin nổi bật

• Application and data serving, Connectivity/Storage Compute Nodes, High Availability Storage Appliance Platform
• Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
• 12 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional NVMe/SATA (rear)
• SAS3 via Broadcom 3008 controller
• 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
• 1 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
• 2x 10GBase-T ports via X557, 1 Dedicated IPMI port
• 1 VGA, 2 COM, 2 USB 3.0, 2 USB 2.0
• 3 High-performance 80mm PWM fans
• 800W Redundant Titanium Level (96%) Power Supplies